Your 1st partner in thermal solutions

Thanks for your prompt feedbacks and appreciate for this honor to be your 1st partner in thermal solutions.

Frankly, you have a good choice of aluminum heatsink with good thermal conductivity and the unit power is fairly normal for operations.

For this application, technically, we'd like to recommend you our TCP150 or TCP200 which could be sufficient for required compression and heat transfer.

In aspect of costs, these two options could be very competitive at affordable price and helpful for your budget cost-down as well.

Here enclosed the TDS for your review first. Thank you!

By the way, please could you advise the annual forecast q'ty for this project so we can evaluate and quote more precisely? Many thanks!

thermal gap fillers will be applied between the cylindric electronic components tube and the bycycle frame

Glad to receive your inquiry and get to know your brief biography from your website. That's awesome!

Well, for this project, per your description, the thermal gap fillers will be applied between the cylindric electronic components tube and the bycycle frame.
But we may have to know more details about the inner structure if available. Thanks!

The components should be in different height as we suppose. so what are the biggest and smallest gap distances?

As you're referring, paste or gel are high-performance materials but it cannot be prevented from moving if the gaps are too much.

For irregular gaps, our 3D mould thermal pad can be a good option for fitting the gaps and stay in good place.

Look forward to your feedbacks soon. Many thanks!

TCP Thermal Pad Technical for RD Ref

Hereblow is our FAE's remark for your RD ref

1. As we hear you that your current thermal pad with additional 3M 467 due to current thermal pad with very lower tacky suface, if with additional 3M 467 which increase its contact thermal resistance enormously and impact on its structural thermal performance for bad compress.

2. Technically , 3M 467 is of thermal conductivity as low ad 0.17w/m.k and after coating with thermal pad of 2.5 w/m.k as a reference, the achieved theoretical thermal conductivity is 1.5w/m.k.

3. Bad re-workability.

Our Suggestion is to have no additional adhesive as blow highlight

1. Our company SinoGuide TCP series TCP500/TCP750 is of excellent tackiness to small IC or metal plates for assembly.

2. Natrual tacky and requires no additional adhesive coating than can inhibit thermal performance.

3. High compressible gap filling produces incredibly low thermal resisitances, conformaing well to IC and heat sinks as silicone molecular structure has a good conformity with IC surface for long-term and stable reliability.

4. Good re-workability and Easy to pick-up for handling for lowering your assembly cost. Pls help to explain to your RD for above technical comments, super thanks in advance.

About SinoGuide: (http://www.sg-thermal.com/)

SinoGuide's Thermal team is committed to improving the overall reliability of electronic devices, focusing on widely range of thermal conductive materials design and manufacturing process. Our broad project portfolio and roots in advanced manufacturing result in cost-effective solutions while improving product functionality and quality.

Main Thermal Pad Material Types Seletion

Typical Properties of SinoGuide Thermal Conductive Pad
Properties	Units	TCP100	TCP150	TCP200	TCP300	TCP500	TCP600	TCP750	TCP110U	Test Method
Color	---	Gray	Black	Dark Gray	Blue	Pink~Violet	Light Blue	Violet	pink/white	Visual
Reinforcement Carrier	---	—	—	—	—	—	—	—	Fiberglass	---
Thickness Range	mm	0.25~15	0.25~15	0.25~15	0.25~15	0.25~15	0.3~10	1.0~10	0.5~10	---
natural tacky (1- or 2-sided)	---	2	2	2	2	2	2	2	1	---
Hardness	Shore C	25,35	15,25,35	15,25,35	25,35	30	30	50	5, 15	ASTM D2240
Density	g/cc	1.8	2.2	2.4	2.6	3	3.6	3.8	2.0	ASTM D792
Continuous Use Temp	℃	-40 to 200								EN344
ELECTRICAL
Breakdown Voltage	Kv/mm	≥9	≥9	≥9	≥6.0	≥6.0	≥6.0	≥6.0	≥6.0	ASTM D149
Volume Impedance	ohm-cm	≥4x1012	≥5x1012	≥3.6x1013	≥1.1X1014	≥1.1X1014	≥6.5X1010	≥6.5x1010	≥6.2X1015	ASTM D257
Dielectric Constant	1MHz	5.27	5.2	6	6.8	6.6	6.5	6.8	5.5	ASTM D150
Flame Rating	---	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	UL 94
THERMAL
Thermal Conductivity	W/m.k	1.0	1.5	2.0	3.0	5.0	6.0	7.5	1.1	ASTM D5470

 Learn More: http://www.sg-thermal.com/materials-selection/

CUSTOMERS COMMONLY USED THERMAL PAD SERIES

TCP300 Series-High Thermal Conductivity and Commonly Used in Led Industry 3.00 W/mk High Thermal Conductivity, Naturally tacky, Vibration Damping Learn more

TCP110U Series-Fiberglass Reinforcement and Good thermal conductivity Low-hardness, with 0.05mm glass cloth reinforcement thermal pad Learn more

TCP600 Series-High Thermal Conductivity Low hardness with high thermal conductivity 6.00 W/mk; with natural adhesiveness, more convenient to install and remove Learn more http://www.sg-thermal.com/material-types.html

Thermal Management Solutions for Cooling Electronics

Thermal Management Solutions for Cooling Electronics

Today's electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. 

Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. SinoGuide's engineering team sets a new industry standard for unparalleled support throughout the interface materials design and manufacturing process. Our broad project portfolio, and our roots in manufacturing result in cost-effective solutions while improving product functionality and quality.

thermal interface materials for consumer electronics

Dear Purchasing manager,

Greetings from SinoGuide Technology!

Our company specializes in designing, manufacturering and marketing of  thermal interface materials for consumer electronics.

The following are the superiorities of our thermal materials:

Thermal Grease

TCG300 Series

TCG500 Series

Thermally Conductive Gap Filler

UTP 100 Series

TCP 080 Series

TCP 100 Series

TCP 120 Series

TCP 150 Series

TCP 200 Series

TCP 250 Series

TCP 300 Series

TCP 500 Series

Thermally Conductive Insulator

TC 23G Series

TC 30G Series

TC 45G Series

Phase-Change Materials

PCM 100 Series

Thermally Conductive Tape

TCT120 Series

There is a visible diffence between our materials and others'.

Choosing us, and I am sure our products are a reliable choice.

Please contact me, we can talk more detailes.

Highly appreciated your early reply.

Best regards,

kevin.hu